HP Computer Technické informace stáhnout pdf (Strana 81)

3. Remove the heat sink (2).

NOTE: Due to the adhesive quality of the thermal material located between the heat sink and

the system board components, it may be necessary to move the heat sink from side to side to

detach it.

NOTE: Steps 4 and 5 apply to computer models equipped with an Intel processor and a

graphics subsystem with discrete memory.

4. Following the 1 through 8 sequence stamped into the heat sink, loosen the eight Phillips

PM2.0×11.0 captive screws (1) that secure the heat sink to the system board.

Component replacement procedures 71

1 2 ... 76 77 78 79 80 81 82 83 84 85 86 ... 130 131

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Double power technology T-708 User Manual (24 pages)

Brand: Double-power-technology | Category: Smartphones | Size: 4.16 MB |

English

Table of contents

CONTENTS

2

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