HP C3000 Uživatelský manuál

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HP BladeSystem c3000 Enclosure technologies
technology brief
Abstract.............................................................................................................................................. 2
Overview of HP BladeSystem c3000 Enclosure ....................................................................................... 2
HP Thermal Logic technologies .............................................................................................................. 4
Active Cool fans .............................................................................................................................. 5
HP PARSEC architecture.................................................................................................................... 6
Thermal Logic for the server blade and enclosure................................................................................. 7
Power supplies and enclosure power subsystem................................................................................... 8
HP BladeSystem Power Sizer ......................................................................................................... 9
Pooled power ............................................................................................................................ 10
Dynamic Power Saver mode ........................................................................................................ 11
Power Regulator......................................................................................................................... 11
Power Capping for each server blade........................................................................................... 11
Interconnect options and infrastructure.................................................................................................. 12
Fabric connectivity and port mapping............................................................................................... 13
Virtual Connect.............................................................................................................................. 16
Enclosure-based DVD ROM................................................................................................................. 17
Onboard Administrator ...................................................................................................................... 17
Insight Display ............................................................................................................................... 19
Web GUI...................................................................................................................................... 20
Command-line interface .................................................................................................................. 20
Onboard Administrator cabling ....................................................................................................... 20
Enclosure link cabling..................................................................................................................... 20
Recommendations.............................................................................................................................. 21
Summary .......................................................................................................................................... 21
Appendix A. Acronyms in text............................................................................................................. 22
Appendix B. Fan, power supply, and device bay population guidelines................................................... 23
For more information.......................................................................................................................... 28
Call to action .................................................................................................................................... 28
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Shrnutí obsahu

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HP BladeSystem c3000 Enclosure technologies technology brief Abstract...

Strany 2 - Abstract

Values obtained from the BladeSystem Power Sizer tool are based on worst case loads and are intended for facility planning purposes only. Actual powe

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Connecting with no power redundancy configured If no power redundancy is configured, the total power available is defined as the power available fro

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server power consumption, checks it against the power cap goal, and, if necessary, adjusts server performance to maintain an average power consumptio

Strany 5 - Active Cool fans

Figure 10. Traces on the signal midplane can transmit many different types of signals, depending on which interconnect fabrics are used. The right-h

Strany 6 - HP PARSEC architecture

Figure 11. HP BladeSystem c3000 interconnect bay numbering For interconnect bay mapping purposes, it does not matter in which device bay a server

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interconnect. Depending on the configuration requirements, additional mezzanine cards and interconnects can be populated in: • Mezzanine 1 and Inter

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Figure 13 lists the available configurations for half-height devices installed in device bay N (1–8). Figure 13. Port mapping for HP BladeSystem c30

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Full details about Virtual Connect technology are available in the technology brief entitled “HP Virtual Connect technology implementation for the HP

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The Onboard Administrator aggregates up to eight iLO 2 ports in a c3000 Enclosure, simplifying cable management and providing a graphical interface t

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• Cooling—The Onboard Administrator makes sure there is sufficient cooling capacity for the server blade or interconnect module by retrieving therma

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Abstract The HP BladeSystem c3000 Enclosure is the next generation in an evolution of the entire rack-mounted infrastructure. The c3000 Enclosure is

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More information about the Insight Display is available in the technology brief entitled “Managing the HP BladeSystem c-Class” at this URL: http://h1

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The enclosure link-down port connects to the enclosure link-up port on the enclosure below it. The enclosure link-up port connects to the enclosure l

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Appendix A. Acronyms in text The following acronyms are used in the text of this document. Table A-1. Acronyms Acronym Acronym expansion AC Alterna

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Appendix B. Fan, power supply, and device bay population guidelines Figure B-1. HP BladeSystem c3000 Enclosure – Fan population guidelines. For corr

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Figure B-2. HP BladeSystem c3000 Enclosure – Power supply population guidelines Table B-1. Power supply placement Number of power supplies Power

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Figure B-3. HP BladeSystem c3000 Enclosure – Full-height server blade device bay numbering. Full--height servers should be populated from bottom to

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Figure B-5. The c3000 Enclosure is divided by sheet metal panels into 2 full-height zones. Each horizontal zone is divided vertically by a removable

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27 When installing a companion blade (HP StorageWorks SB40c Storage Blade, HP PCI Expansion Blade, or HP StorageWorks Ultrium 448c Tape Blade), the c

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For more information For additional information, refer to the resources listed below. Resource description Web address General HP BladeSystem infor

Strany 22 - Appendix A. Acronyms in text

Table 1. Comparison of components supported by HP BladeSystem c-Class Enclosures Enclosure c3000 c7000 Height 6U 10U Blade orientation Horizont

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Figure 2. HP BladeSystem c3000 Enclosure – rear view HP Thermal Logic technologies with a variety of HP Thermal Logic onnect er view : t Scalabl

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Active Cool fans Quite often, dense, full-featured, small form-factor servers use very small fans designed to provide localized cooling in the speci

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HP PARSEC architecture HP Parallel Redundant Scalable Enclosure Cooling (PARSEC) architecture is a hybrid model for cooling that combines the best of

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Figure 5. The c3000 Enclosure fan bay and device bay population guidelines Thermal Logic for the server blade and enclosure The server blade des

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Figure 6. Processor heat sink using fully ducted design (left) and a traditional heat sink in a 1U rack-mount server (right) Instant Thermal Monit

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Figure 7. HP BladeSystem c3000 Enclosure supports up to six power supplies The new, high efficiency HP c3000 power supplies provide greater than 9

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