Hp ProLiant SL210t Gen8 Server Uživatelský manuál Strana 38

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Hardware options installation 38
Single-rank DIMMOne set of memory chips that is accessed while writing to or reading from the
memory.
Dual-rank DIMMTwo single-rank DIMMs on the same module, with only one rank accessible at a time.
The server memory control subsystem selects the proper rank within the DIMM when writing to or reading
from the DIMM.
Dual-rank DIMMs provide the greatest capacity with the existing memory technology. For example, if current
DRAM technology supports 2-GB single-rank DIMMs, a dual-rank DIMM would be 4 GB.
Memory subsystem architecture
The memory subsystem in this node is divided into channels. Each processor supports four channels, and
each channel supports two DIMM slots.
Channel Slot Slot number
1
A
E
1
2
2
B
F
3
4
3
C
G
8
7
4
D
H
6
5
DIMM slots are identified by number and by letter. Letters identify the population order. Slot numbers are
reported by ROM messages during boot and are used for error reporting. For the DIMM slot locations, see
"DIMM slot locations ("DIMM slots" on page 12)."
Memory configurations
To optimize node availability, the node supports the following AMP modes:
Advanced ECCProvides the greatest memory capacity for a given DIMM size, while providing up to
4-bit error correction. This mode is the default option for this node.
Mirrored MemoryProvides maximum protection against failed DIMMs. Uncorrectable errors in one
channel are corrected by the mirror channel.
LockstepProvides enhanced protection while making all installed memory available to the operating
system. The node can continue to function if a single-bit or multi-bit memory failure within a single DRAM
device occurs.
AMP options are configured in RBSU. If the requested AMP mode is not supported by the installed DIMM
configuration, the node boots in Advanced ECC mode. For more information, see "HP ROM-Based Setup
Utility (on page 75)."
For the latest memory configuration information, see the QuickSpecs on the HP website
(http://www.hp.com/go/qs).
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