HP Computer Specifikace stáhnout pdf (Strana 92)

2. Remove the heat sink (2).

NOTE: Due to the adhesive quality of the thermal material located between the heat sink and

the system board components, it may be necessary to move the heat sink from side to side to

detach it.

NOTE: Steps 3 and 4 apply to computer models equipped with a graphics subsystem with

UMA memory.

3. Following the 1 through 4 sequence stamped into the heat sink, loosen the four captive Phillips

screws (1) that secure the heat sink to the system board.

82 Chapter 6 Removal and replacement procedures for Authorized Service Provider parts

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HP Computer Specifikace Strana 92